XCZU7EV-L2FBVB900E

XCZU7EV-L2FBVB900E is a microprocessor Zynq™ UltraScale+™ MPSoC. It is based on the UltraScale™ MPSoC architecture. It delivers unprecedented processing, I/O, and memory bandwidth in the form of an optimized mix of heterogeneous processing engines embedded in a next-generation, high-performance, on-chip interconnect with appropriate on-chip memory subsystems. It is able to serve a wide range of applications, including automotive: driver assistance, driver information, and infotainment, wireless communications: support for multiple spectral bands and smart antennas, wired communications: multiple wired communications standards and context-aware network services, data centres: software defined networks (SDN), data pre-processing, and analytics, smarter vision: evolving video-processing algorithms, object detection, and analytics, connected control/M2M: flexible/adaptable manufacturing, factory throughput, quality, and safety.

• High-speed connectivity: 4 PS-GTR; PCIe Gen1/2; serial ATA 3.1; DisplayPort 1.2a; USB 3.0; SGMII
• Graphic processing unit : Arm Mali™-400 MP2; 64KB L2 cache
• System monitor in PS: on-chip voltage and temperature sensing
• JTAG boundary-scan: IEEE Std 1149.1 compatible test interface
• Supports LVCMOS, LVDS, and SSTL, 1.0V to 3.3V I/O, programmable I/O delay and SerDes
• On-chip voltage and temperature sensing, 10bit 200KSPS ADC with up to 17 external inputs
• 504,000 system logic cells, 460,800 CLB flip-flops, 230,400 CLB LUTs
• 6.2Mb distributed RAM, 312 block RAM blocks, 11Mb block RAM
• 900-pin FCBGA package
• Extended temperature range from 0°C to +100°C

Avvertenze

Informazioni di garanzia: I prodotti semiconduttori Xilinx godono di una garanzia di dodici (12) mesi dalla data di acquisto. La domanda di mercato ha causato un'estensione dei tempi di consegna. Le date di consegna potrebbero variare. Prodotto esente da sconti.

Note

Nota: Questo prodotto non è annullabile, nè restituibile (NCNR)