509-0738

Multicomp Typ 505 solid fluxes for cored solder wires have been specially formulated to complement no clean wave and reflow soldering processes. They are also applicable to repair operations carried out after a cleaning process, eliminating the need for further cleaning. Multicomp flux cored solder wires provide fast soldering on copper and brass surfaces as well as solder coated materials. Activity of the halide activated versions on nickel is also good depending on the state of oxidation of the nickel finish. The good thermal stability of fluxe 505 means, they are also well suited to soldering applications requiring high melting temperature alloys.

• Formulazione del flussante no-clean, leggermente attivata
• Contenuto di flussante aumentato (3% del peso) - bassa produzione di fumi e schizzi
• I residui minimi trasparenti non richiedono pulizia
• Conforme a tutti i requisiti legislativi senza piombo
• Adatto per l’assemblaggio o la rilavorazione generale di PCB con processi di saldatura privi di piombo e no-clean
• I prodotti Multicomp sono valutati 4,6 stelle su 5
• Garanzia limitata 12 mesi *vedi Termini e condizioni per i dettagli
• Il 96% dei clienti lo consiglierebbe a un amico

Note

Lead Free. Material Composition: 99.3% Tin, 0.7% Copper. Resin based flux, halide activated, low activation level