507-1422
Filo di saldatura, senza piombo, diametro 0.7mm, 227°C, 500g, lega 99.3, 0.7 Sn, Cu
20 Puoi prenotare le disponibilità ora
| Quantità | |
|---|---|
| 1+ | € 79,840 |
| 10+ | € 72,900 |
Informazioni sui prodotti
Panoramica del prodotto
Multicomp Typ 400 solder wires have been specially formulated to complement No Clean wave and reflow soldering processes. They are also applicable to repair operations carried out after a cleaning process, eliminating the need for further cleaning. This is designed for users who require a halide free formulation. Multicomp solder wires provide fast soldering on copper and brass surfaces as well as solder coated materials. Activity of the halide activated versions on nickel is also good depending on the state of oxidation of the nickel finish. The good thermal stability of fluxes means they are also well suited to soldering applications requiring high melting temperature alloys.
- Solder wire applicable at repair operations
- Designed for users who require a halide free formulation
- Formulated to complement no clean wave and reflow soldering processes
- Multicomp products are rated 4.6 out of 5 stars
- 12-month limited warranty *view Terms & Conditions for details
- 96% of customers would recommend to a friend
Note
Lead Free. Material Composition: 99.3% Tin, 0.7% Copper. Rosin based flux, halide activated, normal activation level
Specifiche tecniche
senza reofori
99.3, 0.7 Sn, Cu
0.028"
500g
Multicomp Type 400 Solder Wire
colofonia No-Clean
0.7mm
227°C
1.102lb
No SVHC (14-Jun-2023)
Documenti tecnici (2)
Alternative per 507-1422
2 prodotti trovati
Prodotti associati
2 prodotti trovati
Legislazione e ambiente
Paese in cui si è svolta l'ultima parte più significativa del processo produttivoPaese d'origine:Germany
Paese in cui si è svolta l'ultima parte più significativa del processo produttivo
RoHS
RoHS
Certificato di conformità del prodotto