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Informazioni sui prodotti
Panoramica del prodotto
EVALIM67D130FLEXKITTOBO1 is a XENSIV™ MEMS microphone flex evaluation kit that allows for evaluation with minimal effort. Its small size and flexibility enables direct placement of the flex board into a prototype. Each flex kit consists of five flex boards and one adapter board. The digital flex board is equipped with a digital PDM output microphone and a 0.1µF supply bypass capacitor. It can be connected to a 6-position ZIF connector with a 0.5mm pin spacing, such as the Molex 0527450697, or wires can be soldered directly on the flex board. The analogue flex board is equipped only with the differential MEMS microphone. The adapter board has a 6-position ZIF and a 2.54mm board-to-board connector. The adapter board provides the ability to configure the select pin of digital microphone to VDD or Ground.
- Quick and easy connection to evaluation system
- Small size is 25mm x 4.5mm
- Pre soldered MEMS microphone
- Configurable select pin configuration for digital microphones
Contenuti
Five XENSIV™ MEMS microphones IM67D130A mounted on flex board, Adapter board.
Specifiche tecniche
Infineon
Audio
5 x Flex Board IM67D130A, 1 x Adapter Board
No SVHC (27-Jun-2018)
IM67D130A
Microfono MEMS
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Documenti tecnici (1)
Legislazione e ambiente
Paese in cui si è svolta l'ultima parte più significativa del processo produttivoPaese d'origine:Germany
Paese in cui si è svolta l'ultima parte più significativa del processo produttivo
RoHS
RoHS
Certificato di conformità del prodotto