NV6512C-RA
Power IC, GaNsafe, 11-18V, 55 mohm, -55 a 150°C, raffreddamento lato inferiore, TOLL-4
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Quantità | |
---|---|
10+ | € 19,140 |
25+ | € 16,910 |
50+ | € 15,490 |
100+ | € 14,770 |
Informazioni sui prodotti
Panoramica del prodotto
NV6512C-RA is a power IC. It is a thermally-enhanced bottom-cooled SMD version of the GaNFast™ power IC family, optimized for higher power systems using GaNSafe™ technology, making it the ideal choice for high-frequency, high-power-density, and high efficiency power systems in data centre, solar, industrial, and automotive segments. The GaNFast power IC integrates GaN FET(s) with gate drive to create an easy-to-use power stage building block. The GaNSafe technology further integrates critical protection and performance features that enable unprecedented reliability and robustness. Applications/topologies include AC-DC, DC-DC, CCM or CrM TP-PFC, optimized for synchronous half-bridge, full bridge, 3-phase, or buck/boost operation, data centre CRPS, and solar inverter/ESS, EV OBC and DC-DC converter, and motor drive.
- Paralleling capability up to 2x power ICs
- Zero reverse-recovery charge, 2kV ESD all pins
- Turn-ON and Turn-OFF dV/dt programmability
- VDS: 650V continuous / 800V transient
- Drain-source leakage current is 2.0µA typ at VDS = 650V, VDRIVE = 0V
- Drain-source resistance is 40mohm typ at VDRIVE = 15V, IDS = 13A
- JEDEC and IPC-9701 qualifications
- dV/dt immunity up to 100V/ns
- TOLL-4L bottom-cooled SMD package
- Junction temperature range from -40 to +150°C
Specifiche tecniche
PMIC GaNsafe
18V
-40°C
GaNSafe Series
11V
4Pin
150°C
Documenti tecnici (1)
Legislazione e ambiente
Paese in cui si è svolta l'ultima parte più significativa del processo produttivoPaese d'origine:China
Paese in cui si è svolta l'ultima parte più significativa del processo produttivo
RoHS
Certificato di conformità del prodotto