Print Page
Image is for illustrative purposes only. Please refer to product description.
376 In Stock
Need more?
1-2 Working Days Delivery
Order before 17:00 standard shipping
Quantity | Price (ex VAT) |
---|---|
1+ | €8.430 |
10+ | €7.830 |
25+ | €7.590 |
50+ | €7.410 |
100+ | €7.230 |
250+ | €6.990 |
Price for:Each
Minimum: 1
Multiple: 1
€8.43 (ex VAT)
Enter Your Part No/Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
This number will be added to the Order Confirmation, Invoice, Dispatch note, Web confirmation Email and Product Label.
Product Information
ManufacturerMICRON
Manufacturer Part NoMT53D512M16D1DS-046 WT:D
Order Code4128274
Technical Datasheet
DRAM TypeMobile LPDDR4
Memory Density8Gbit
Memory Configuration512M x 16bit
Clock Frequency Max2.133GHz
IC Case / PackageWFBGA
No. of Pins200Pins
Supply Voltage Nom1.1V
IC MountingSurface Mount
Operating Temperature Min-25°C
Operating Temperature Max85°C
Product Range-
Product Overview
MT53D512M16D1DS-046 WT:D is a mobile LPDDR4 SDRAM. The mobile low-power DDR4 SDRAM with low VDDQ (LPDDR4X) is a high-speed CMOS, dynamic random-access memory. The device is internally configured with x16 I/O, 8-banks. Each of the x16’s 1,073,741,824bit banks are organized as 65,536 rows by 1024 columns by 16 bits. LPDDR4 uses a double-data-rate (DDR) protocol on the DQ bus to achieve high-speed operation. The DDR interface transfers two data bits to each DQ lane in one clock cycle and is matched to a 16n-prefetch DRAM architecture.
- 16n prefetch DDR architecture, 8 internal banks per channel for concurrent operation
- Single-data-rate CMD/ADR entry, bidirectional/differential data strobe per byte lane
- Programmable READ and WRITE latencies (RL/WL), programmable and on-the-fly burst lengths (BL=16, 32)
- Directed per-bank refresh for concurrent bank operation and ease of command scheduling
- On-chip temperature sensor to control self refresh rate
- Partial-array self refresh (PASR), selectable output drive strength (DS), clock-stop capability
- 2133MHz clock rate, 4266Mb/s/pin data rate
- 1.10V VDD2 / 0.60V VDDQ or 1.10V VDDQ ordering voltage
- 512 Meg x 32 configuration
- 200-ball WFBGA package, -25°C to +85°C operating temperature
Technical Specifications
DRAM Type
Mobile LPDDR4
Memory Configuration
512M x 16bit
IC Case / Package
WFBGA
Supply Voltage Nom
1.1V
Operating Temperature Min
-25°C
Product Range
-
Memory Density
8Gbit
Clock Frequency Max
2.133GHz
No. of Pins
200Pins
IC Mounting
Surface Mount
Operating Temperature Max
85°C
SVHC
No SVHC (17-Dec-2015)
Technical Docs (2)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Tariff No:85423239
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Dec-2015)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.00001